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BGA BallGrid ArrayBQFP132EBGA680L LBGA160LPBGA217LPlastic BallGrid ArraySBGA192LTSBGA680L C-Bend Lead览表深圳南方昊昱电子有限公司SHENZHEN SOUTHERNHAOYU ELECTRONICSCO,LTDoCERQUADCeramic QuadFlat PackCLCC嗝♦CPGA CeramicPin GridArray1■iDIP-tabDual Inline Package withMetal HeatsinkFBGAFDIP FTO220Flat PackGull WingLeadsHSOP-28HSOP28IT03p JLCCLCCLGALQFPPlastic PinGrid ArrayPSDIPZIPZig-Zag InlinePackagePLCC PQFPPCDIPPCMCIAPDIP PGALQFP100L METALQUAD1OOLPQFP1OOL QFPQuadFlat PackageQFPQuadFlat PackageTQFP1OOLSBGA SDIPSingleInlinePackageSNAPTK SNAPTK・・・三三三三三一一三三王三三一三二三三・nxyh可冢SNAPZP SODIMMSmall OutlineDual In-line MemoryModuleSOSmall Outline Package SOHct:,;EC-llI.•”;:T=~mcs=gk;i;er14:SSTO-220SOT220SOP EIAJTYPE II14L SOT220SOT523SOT223SOT223SOT343SOT23SOT23/SOT323SOT26/SOT363SOT25/SOT353BOT€9SOT89SOT89SSOP16L SSOPTSSOPor TSOPIITSOPThin ShrinkOutlinePackageThin SmallOutline PackageTO5TO3TO264TO220T018芯片封装形式。