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项目内容常规特殊1层数NO.OFLAYER2—16层20层2完成板尺寸最大FINISHEDBOARDSIZEMAX18X24”457mmX610mm3完成板尺寸最小FINISHEDBOARDSIZEMIN
1.5〃X
2.0〃38mmX51mm4板厚度最大BOARDTHICKNESSMAX
0.177〃
4.5mm5板厚度最小BOARDTHICKNESSMIN
0.
0160.4mm6芯片厚度最小T/CTHICKNESSMIN
0.0039〃
0.1mmO.08mm7成品厚度公差板厚
20.8mmFINISHEDBOARDTHICKNESSTOLERANCEBOARDTHICKNESS^
0.8MM+10%8成品厚度公差
0.4mmW板厚W
0.8nimFINISHEDBOARDTHICKNESSTOLERANCE
0.4mm^B0ARDTHICKNESS
0.8mm±3mil±
0.075mm9板曲最小WARPAGEmin
0.7%10钻孔孔径最大DRILLHOLEDIAMETERMAX
0.
2646.7mm11钻孔孔径最小DRILLHOLEDIAMETERMIN
0.0098〃
0.25mm12完成孔孔径最小FINISHEDVIADIAMETERMIN
0.008”
0.20mm13外层底铜厚度最小BASECOPPERTHICKNESSOFOUTERLAYERMIN1/30Z
0.012mm14外层底铜厚度最大BASECOPPERTHICKNESSOFOUTERLAYERMAX30Z
0.105mm15内层底铜厚度最小BASECOPPERTHICKNESSOFINNERLAYERMIN1/2OZ
0.017mm16内层底铜厚度最大BASECOPPERTHICKNESSOFINNERLAYERMAX2OZ
0.07mm17绝缘层厚度最小DIELECTRICTHICKNESSOFINNERLAYERMIN
0.0039”
0.1mm项目内容常规特殊18板料类型BASEMATERIALTYPECEM-3;FR-4130℃Tg;FR-4140℃Tg;FR-4170℃Tg;19孔电镀纵横比最大ASPECTRATIOOFPLATEDHOLEMAX7:18:120孔径公差镀通孔HOLEDIAMETERTOLERANCEPTII±3mil+
0.076mm±2mil21孔径公差非镀通孔HOLEDIAMETERTOLERANCENPTH±2mil±
0.051mm±lmil22孔位公差与CAD数相比HOLEPOSITIONTOLERANCECOMPAREDWITHCADDATA±3mil±
0.076mm23孔壁铜厚SMOBCCOPPERTHIKNESSFORPTHWALLSMOBC21nli
120.025mm24孔壁铜厚全板镀金板肓埋孔板COPPERTHICKNESSFORPTHWALLFLASHGOLDPROCESSBLINDORBURIEDHOLEPROCESS
20.6mil
20.015mm25外层设计线宽/间距最小OUTERLAYERDESIGNLINEWIDTH/SPACEMINT/TOZ4mil/5mil
0.1016mm/
0.127mmH/HOZ4mil/5mil
0.1016mm/
0.127mm1/10Z6mil/6mil
0.152mm/
0.152mm2/20Z7mil/7mi
0.178mm/
0.178mm3/30Z8mil/8mil
0.203mm/
0.203mm4/4milTforl/3oz26内层设计线宽/间距最小INNERLAYERDESIGNLINEWIDTH/SPACEMINH/HOZ4mil/4mil
0.1016mm/
0.1016mm1/10Z4mil/4mil
0.1016mm/
0.1016mm2/20Z6mil/6mil
0.152mm/
0.152mm3/30Z6mil/6mil
0.152mm/
0.152mm3mil/3mil
3.5mil/
3.5mil项目内容常规特殊27蚀刻公差TOLERANCEAFTERETCHING2±20%28内外层阻抗IMPEDANCETOLERANCEOFINNER/OUTTERLAYERIMPEDANCEVALUE50QIMPEDANCEVALUE50Q线宽±1皿24mil线宽±5029图形对图形精度最小IMAGETOIMAGETOLERANCEMIN±5mil±
0.127mm30外层图形对孔位精度(最小)±4mil±
0.102mmIMAGETOHOLETOLERANCEMIN31外层图形对板边精度最小IMAGETOBOARDEDGETOLERANCEMTN±6mil±
0.152mm32孔位对孔位精度最小HOLETOHOLEPOSITIONTOLERANCEMIN巾dl.Omni巾d
21.Omm±5mil±
0.127mm±3mil+
0.076mm33孔位对板边精度最小HOLETOBOARDEDGETOLERANCEddl.Omm6d
21.Omm±8mil+
0.204mm±6mil±
0.152mm34阻焊对位精度公差SOLDERMASKREGISTRATION±5mil±3mil35阻焊厚度最小SOLDERMASKTHICKNESSMINlOum36阻焊桥宽最小SOLDERMASKBRIDGEMIN3mil
0.076mm37阻焊塞孔孔径SOLDERMASKPLUGINGHOLEDIAMETER
20.75孔内上锡SOLDERINHOLE
0.55—
0.75单面锡珠SOLDERBALLONESIDEWO.55无锡珠NOSOLDERBALL38字符线宽COMPONENTMARKWIDTHCMIN4mil39绿油开窗文字宽度最小LETTERWIDTHMINOFSOLDERMASKOPENING5mil项目内容常规特殊40金插头开窗到阻焊盘窗最小S/MOPENINGSPACEBETWEENGOLDFINGERSOLDERPADMIN8mil
0.203mm41金插头镀银厚度最大NICKELTHICKNESSFORGOLDFINGERMAX160uin4um42金插头镀金厚度最大GOLDTHICKNESSOFGOLDFINGERMAX40uin
1.Oum
1.2um43金插头镀金厚度最小GOLDTHICKNESSOFGOLDFINGERMin4uin
0.2um
0.linn43金插头高度最大GOLDFINGERHEIGHTPANELEDGETOTOPOFGOLDFINGERMAX10254mm44金插头倒边深度公差(最小)TOLERANCEOFCHAMFERDEPTH(MIN)±7mil±
0.18mm30°±5mil±
0.127mm230°45金插头倒边角度及公差RANGEOFCHAMFERANGLECHAMFERANGLETOLERANCE45°-75°±5°±1°46金插头与相邻TAB间距最小自动SPACEBETWEENGOLDFINGERANDTABMIN
0.134〃
3.4mm47沉锲/金银厚最薄点最大NICKELTHICKNESSFORENIGMEASUREDATTHEMINIMUMPOINTMAX150uin
3.8um48沉银/金金厚最薄点最大GOLDTHICKNESSFORENIGMEASUREDATTHEMINIMUMPOINTMAX4uin
0.lum49全板镀金薄金银厚最薄点最大NICKELTHICKNESSFORFLASHGOLDPLATINGSOFTGOLDMEASUREDATTHEMINIMUMPOINTMAX200uin5um50全板镀金薄金金厚最薄点最大GOLDTHICKNESSFORFLASHGOLDPLATINGSOFTGOLDMEASUREDATTHEMINIMUMPOINTMAX2uin
0.05um项目内容常规特殊51全板镀金厚金银厚最薄点最大NICKELTHICKNESSFORFLASHGOLDPLATINGHARDGOLDMEASUREDATTHEMINIMUMPOINTMAX200uin5um52全板镀金厚金金厚最薄点最大GOLDTHICKNESSFORFLASHGOLDPLATINGHARDGOLDMEASUREDATTHEMINIMUMPOINTMAX3uin
0.075um
0.lum53锡厚热风整平最小SOLDERTHICKNESSONXFPHALMINlOOuin
2.54uin54锡厚热风整平最小SOLDERTHICKNESSONPADSEXCEPTXFPMIN40uin
1.0um55碳油阻抗CARBONINKRESISTANCE18\口56碳油间距(最小)15mil
0.375mmSPACEFORCARBONCONDUCTORMIN57冲外形公差边到边最小CM-X系列PUNCHINGDTMENSTONTOLERANCEEDGETOEDGEMIN±6mil±
0.152mm±5mil58冲外形公差孔到边最小CM-X系列PUNCHINGDTMENSTONTOLERANCEHOLETOEDGEMIN±5mil±
0.127mm±4mil59冲外形公差边到边最小FR-X系列PUNCHINGDIMENSIONTOLERANCEEDGETOEDGEMIN+8mil+O.20mm±5mil60冲外形公差孔到边最小FR-X系列PUNCHINGDIMENSIONTOLERANCEHOLETOEDGEMIN+7mil+O.175mm±4mil61铳外形公差边到边最小ROUTINGDIMENSIONTOLERANCEEDGETOEDGEMIN±4mil±
0.101mm2mil62铳外形公差孔到边ROUTINGDIMENSIONTOLERANCEHOLETOEDGEMIN±4mil±
0.101mm63铳外形圆弧内角最小RADIUSBYROUTINGINTERNALANGLEMIN216mil
0.4mm项目内容常规特殊64铳沉头孔孔径当顶角角度为165最大COUNTERSINKHOLESIZEWHENTOPANGIEIS165°MAX
0.25〃
6.35mm65长槽宽度(最小)SLOTWIDTH(MIN)20mi
10.5mm66长槽形状公差沉铜当长度22X宽度+
0.15mmSLOTTOLERANCEPTIIL22W+
0.15mm±4mil±
0.10mm67长槽形状公差沉铜当长度2X宽度+
0.15mmSLOTTOLERANCEPTHL2W+
0.15mm±5mil±
0.127mm68长槽形状公差(非沉铜)NON-PLATEDSLOTTOLERANCE±3mil±
0.08mm69V一槽筋厚公差最小V—CUTREMAININGTHICKNESSTOLERANCEMIN±4mil+
0.10mm70V一槽角度公差
30、60最小V-CUTANGLETOLERANCE30°~60MTN±5°±4°71v一槽错位度最小V—CUTMISREGISTRATIONMIN±5mil±
0.127mm72切割V一槽的板厚度最小BOARDTHICKNESSTHATCANBEV—CUTMIN24mi
10.6nim20mil
0.5mm73v一槽对孔公差最小V—CUTTOHOLETOLERANCEMIN±6mil±
0.150mm74v一槽对v一槽位置公差最小V—CUTTOV—CUTPOSITIONTOLERANCEMIN±5mil±
0.127mm75V-CUT到板边的尺寸最大SIZEFROMTHEV-CUTLINETOBOARDEDGEMAX18inch76金插头蓝胶厚度THICKNESSOFTHEBLUEPLASTER
0.2-
0.4mm。